july 2012 ? 2011 fairchild semiconductor corporation www.fairchildsemi.com FPF3003 ? rev. 1.0.0 FPF3003 ? intellimax? full functional i nput power path management switch for dual-battery portable systems FPF3003 intellimax? full functional input power path management switch for dual-battery portable system features ? 2.3v to 5.5v input vo ltage operating range ? low r on between battery and load maximum 50m ? at v in = 4.2v ? low r on between charger and battery maximum 125m ? at v in = 4.2v ? maximum dc current for load switch: 2.5a ? maximum dc current for charge switch: 1.5a ? slew rate controlled to 30s nominal rise time ? seamless break-before-make transition ? quiescent current: 30a typical ? thermal shutdown ? reverse current blocking (rcb) between battery a and battery b ? reset timer delay: 7s typical ? esd protected: - human body model: >2.5kv - charged device model: >1.5kv - iec 61000-4-2 air discharge: >15kv - iec 61000-4-2 contact discharge: >8kv ? 1.6mm x 1.6mm, 16-bump, 0.4mm pitch, wlcsp applications ? dual-battery cell phone ? dual-battery portable equipment description the FPF3003 is a single-chip solution for dual-battery power-path switching, includ ing integrated p-channel switches and analog control f eatures. the input voltage range operates from 2.3v to 5.5v. the device selects one of two batteries to provide power to the system, enabling one battery to be charged by the external battery charger. the FPF3003 has battery voltage monitoring to determine if the battery is under voltage. special driver and digital circuitry allows the device to switch quickly between battery a and battery b, which allows hot swapping of battery packs. maximum current from battery to load per channel is limited to a constant 2.5a and internal thermal shutdown circuits protect the part during fault conditions. the FPF3003 is available in a 1.6mm x 1.6mm, 16-bump, wafer-level chip-scale package (wlcsp). ordering information part number top mark (charger-battery) max. r on at 4.2v in (battery-load) max. r on at 4.2v in typical t r package FPF3003ucx qw 125m ? 50m ? 30s 16-bump, 0.4mm pitch, 1.6mm x 1.6mm wlcsp
? 2011 fairchild semiconductor corporation www.fairchildsemi.com FPF3003 ? rev. 1.0.0 16 FPF3003 ? intellimax? full functional in p ut power path mana g ement switch for dual-batter y portable s y stems packaging information figure 38. 1.6mmx1.6mm wlc sp, 16-bumps 0.4mm pitch product-specific dimensions product d e x y FPF3003ucx 1560 m 30 m 1560 m 30 m 180 m 180 m package drawings are provided as a service to customers consi dering fairchild components. drawings may change in any manner without notice. please note the revision and/or date on the drawi ng and contact a fairchild semiconductor representative to ver ify or obtain the most recent revision. package specifications do not expand the terms of fairchild?s worldwide terms and conditions, specifically the warranty therein, which covers fairchild products. always visit fairchild semiconductor?s online packagi ng area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ . bottom view side views top view recommended land pattern ball a1 index area 1 2 3 4 a b c d seating plane 16x a1 0.005 cab f (nsmd pad type) ?0.2600.02 0.40 0.40 (x) 0.018 (y) 0.018 0.625 0.547 0.06 c 0.05 c e d f 0.3780.018 0.2080.021 notes: a. no jedec registration applies. b. dimensions are in millimeters. c. dimensions and tolerance per asme y14.5m, 1994. d. datum c is defined by the spherical crowns of the balls. e. package nominal height is 586 microns 39 microns (547-625 microns). f. for dimensions d, e, x, and y see product datasheet. g. drawing filname: mkt-uc016aarev2. 0.03 c 2x 0.03 c 2x e d b c a 0.40 0.40 (?0.20) cu pad (?0.30) solder mask opening
? 2011 fairchild semiconductor corporation www.fairchildsemi.com FPF3003 ? rev. 1.0.0 17 FPF3003 ? intellimax? full functional in p ut power path mana g ement switch for dual-batter y portable s y stems
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